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INTEGRATED CIRCUITS
DATA SHEET
PCD509x2/zuu/v family Low cost; low power DECT baseband controllers (ABC-PRO)
Objective specification File under Integrated Circuits, IC17 1998 Apr 27
Philips Semiconductors
Objective specification
Low cost; low power DECT baseband controllers (ABC-PRO)
CONTENTS 1 2 3 4 5 5.1 5.2 6 6.1 7 8 8.1 8.2 8.3 8.4 9 10 11 FEATURES GENERAL DESCRIPTION ORDERING INFORMATION BLOCK DIAGRAM PINNING INFORMATION Pinning Pin description FUNCTIONAL DESCRIPTION DECT baseband controller system PACKAGE OUTLINES SOLDERING Introduction Reflow soldering Wave soldering Repairing soldered joints DEFINITIONS LIFE SUPPORT APPLICATIONS PURCHASE OF PHILIPS I2C COMPONENTS
PCD509x2/zuu/v family
1998 Apr 27
2
Philips Semiconductors
Objective specification
Low cost; low power DECT baseband controllers (ABC-PRO)
1 FEATURES
PCD509x2/zuu/v family
* The PCD50912 is designed for GAP compatible DECT handsets * The PCD50922 is designed for GAP compatible DECT base stations serving up to six handsets * Fully static 80C51 microcontroller * Emulation supported for 80C51 program development * Four 8-bit ports (P0, P1, P2 and P3), 32 I/O lines * Dedicated port pins for keyboard, I2C-bus, interrupt sources and/or external memory * Fifteen interrupt sources (including those from TICB, BML and DSP) with two priority levels * I2C-bus interface * UART with IrDA-compatible Data Transmission Mode * 256 bytes of microcontroller main RAM * 3 kbytes of microcontroller AUX RAM * 1 kbyte of shared System Data RAM * 64 kbytes of mask programmable ROM * 128 kbyte address space for external ROM access, maximum 192 kbytes together with internal ROM * 128 kbytes of external RAM addressable * Embedded DSP with 6.912, 13.824 or 27.648 Mips * Speech and IOM-2 interface * BML for TDMA frame (de)multiplexing. Transmission or reception can be programmed for any slot * Ciphering, scrambling, CRC checking/generation, protected B-fields * Local call and B-field loop-back * Automatic receiver delay adjustment programmable per slot to correct for terminal mobility * Phase error measurement and phase error correction by hardware * Serial interface to synthesizer for frequency programming * Programmable timing and polarity of radio-control signals * Easy interfacing with radio circuits, operating at different supply voltages * GMSK pulse shaper with two different pulse shapes (BT = 0.5 and BT = 0.8) * Comparator for use as bit-slicer * 3 channel time-multiplexed 8-bit ADC for RSSI, battery and general input voltage measurement * Battery management supported by programmable current source for temperature or charge current measurement * On-chip 8-bit DAC for various purposes * Low power crystal oscillator at 13.824 MHz * Programmable on-chip capacitors for frequency adjustment to 13.824 MHz with large pulling range * High performance DAC and ADC for dynamic earpiece and dynamic or electret microphone * Analog-to-digital path switchable sensitivity for microphone or line interface input * On-chip reference voltage and supply for electret microphone * Very low ohmic buzzer output * Pulse density modulated or pulse width modulated buzzer output signal * Power-on-reset * Low power operation optimized for 2 battery cells in handset * Long standby time due to reduced digital supply voltage and reduced activity in idle-locked mode * Flexible supply voltage concept due to use of level shifters between each supply voltage domain * Eight independent supply voltage domains: - 1.8 to 3.6 V for digital core, microcontroller ports P0 and P2, and also P1 and P3 - 1.8 to 3.6 V for buzzer, oscillator and battery - 2.7 to 3.6 V for RF interface and analog circuits * CMOS technology * Small and flat LQFP80 package.
1998 Apr 27
3
Philips Semiconductors
Objective specification
Low cost; low power DECT baseband controllers (ABC-PRO)
2 GENERAL DESCRIPTION
PCD509x2/zuu/v family
This family specification contains the hardware description that is independent of the used ROM codes. The numerical digit `x' in PCD509x2 determines the intended application area (e.g. PCD50912 for use in handsets or PCD50922 for use in simple base stations, etc.). The last numerical digit `2' is used to denote hardware derivatives. The extension digits `z' (A to Z) and `uu' (00 to 99) denote the DSP and the microcontroller software version, respectively. The extension `v' denotes the hardware version updates of the circuit. Although the microcontroller ROM code is present on-chip, an external program memory for the microcontroller code can be used. This is not the case for the DSP ROM code which is fixed by the chip version. Throughout this family specification the term PCD509x2 is used to cover all sub types and versions. If any specific feature or parameter is connected to a certain sub type or version this will be specifically written. Until otherwise stated this family specification is valid for hardware version 1 (v = 1).
The PCD509x2 family is designed for low power GAP compatible DECT handset (PP) and base station (FP) applications. The circuit includes the audio interface, the DSP, the microcontroller and the Burst Mode Logic, and contains all functionality to convert speech and data signals from/to the analog side (microphone and earpiece or line interface circuit) to/from the radio side (1.152 Mbits/s data). This circuit is a member of the ABC family, where A stands for `ADPCM codec', B for `Burst Mode Logic' and C for `microController'. The name ABC-PRO stands for PROfessional ABC. The PCD509x2/zuu/v contains on-chip ROM for the embedded DSP code and on-chip ROM for the embedded microcontroller code. It is these ROM codes that differentiate between various chip derivatives. For each DSP code a separate DSP user manual is published. Please contact Philips Semiconductors for more information. 3 ORDERING INFORMATION TYPE NUMBER PCD50912H PCD50922H
PACKAGE NAME LQFP80 DESCRIPTION plastic low profile quad flat package; 80 leads; body 12 x 12 x 1.4 mm VERSION SOT315-1
1998 Apr 27
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1998 Apr 27
ANT_SW0 ANT_SW1 T_ENABLE T_PWR GPP S_ENABLE S_DATA S_CLK S_PWR R_ENABLE R_PWR SLICE_CTR REF_CLK
4
Philips Semiconductors
ALE EA PSEN
A16 8
P0 8
P2
P1(1) 8
P3(1)
Low cost; low power DECT baseband controllers (ABC-PRO)
BLOCK DIAGRAM
8 VDD(P1, P3) LEVEL SHIFTER PORT 3 IB BUS digital pins analog pins supply pins
VDD(P0, P2) LEVEL SHIFTER LEVEL SHIFTER PORT 0 LEVEL SHIFTER PORT 2
VDDD
VDDD
LEVEL SHIFTER PORT 1
PCD509x2
SPEECH INTERFACE IOM(R) ADPCM (SPI)
80CL51 CORE
ROM (64 kBYTES)
AUX-RAM (3 kBYTES)
MICROCONTROLLER-RAM (256 BYTES)
I2C-BUS
UART
AB-MICROCONTROLLER INTERFACE (ABCIF) VDD(RF) VDDD VDDD
MICROCONTROLLER
VDDD VSSD VDD(P1, P3) VDD(P0, P2) VSS(P0, P2) VDD(BZ) VSS(BZ) VDD(RF) VSS(RF) VDDA VSSA VDD(OSC) VSS(OSC) VDD(BAT)
VDDD
VDD(BZ)
VDDD
DIGITAL PULSE SHAPER (DPS) DIGITAL SIGNAL PROCESSOR (DSP)
LEVEL SHIFTER DIGITAL RECEIVE FILTER (DRF)
BUZZER BUFFER (ABB)
BZP BZM
LEVEL SHIFTER
BURST MODE LOGIC (BML)
R_DATAP R_DATAM
SYSTEM DATA RAM (SDR) (1 kBYTE)
DIGITAL NOISE SHAPER (DNS)
1-BIT DAC (ARD)
EARP EARM
5
T_GSMK/ T_DATA AGM VDD(OSC) VDDD CLOCK GENERATOR (CLG) TIMING CONTROL BLOCK (TICB) WATCHDOG TIMER (WDT) ISB XTAL1 ISB BUS CONTROLLER (IBC) LEVEL SHIFTER XTAL2
LEVEL SHIFTER DIGITAL DECIMATING FILTER (DDF)
CODEC
1-BIT ADC ATS MICP/LIFM AMP MICM/LIFP
MEMORY
VDDA VDDA Vref DIGITAL CONTROL OF ANALOG (DCA) LEVEL SHIFTER VDD(BAT) ANALOG VOLTAGE REFERENCE (AVR) POWER-ON-RESET (POR) ANALOG VOLTAGE SOURCE (AVS) ANALOG SUBTRACTOR (ASU) ANALOG RSSI TREATMENT (ART) ADJUSTABLE CURRENT SOURCE (ACS) VANLI VDD(BAT) RSSI_AN Vref
ANALOG SWITCH (ASW)
PCD509x2/zuu/v family
AUXILIARY ADC (AAD)
RESET GENERATOR (RGE)
LEVEL SHIFTER
Objective specification
MGM858
M_RESET VBGP VANLO
(1) Ports 1 and 3 are shared with alternative functions.
Fig.1 Block diagram.
Philips Semiconductors
Objective specification
Low cost; low power DECT baseband controllers (ABC-PRO)
5 5.1 PINNING INFORMATION Pinning
PCD509x2/zuu/v family
78 P1.4/INT6/DCK
75 P1.7/INT9/SDA
79 P1.3/INT5/DO
80 P1.2/INT4/DI
74 VDD(P1, P3)
andbook, full pagewidth
68 P3.3/INT1/IrDA
76 P1.6/INT8/SCL
77 P1.5/INT7/FS1
69 P3.2/INT0
71 P3.0/RXD
70 P3.1/TXD
65 P3.6/WR
64 P3.7/RD
67 P3.4/T0
66 P3.5/T1
73 VDDD
72 VSSD
62 P0.0
P1.1/INT3 P1.0/INT2 M_RESET ANT_SW0 ANT_SW1 T_ENABLE T_PWR GPP S_ENABLE
1 2 3 4 5 6 7 8 9
61 P0.1 60 P0.2 59 P0.3 58 P0.4 57 P0.5 56 P0.6 55 P0.7 54 ALE 53 PSEN 52 VDD(P0, P2) 51 VSS(P0, P2) 50 A16 49 P2.7 48 P2.6 47 P2.5 46 P2.4 45 P2.3 44 P2.2 43 P2.1 42 P2.0 41 VSS(BZ) BZP 40
S_DATA 10
PCD509x2/zuu/v
S_CLK 11 S_PWR 12 R_ENABLE 13 R_PWR 14 SLICE_CTR 15 VDD(RF) 16 VSS(RF) 17 REF_CLK 18 RSSI_AN 19 T_GSMK/T_DATA 20 R_DATAP 21 R_DATAM 22 VDD(OSC) 23 XTAL2 24 XTAL1 25 VSS(OSC) 26 VDD(BAT) 27 VANLI 28 VANLO 29 VDDA 30 EARM 31 EARP 32 VSSA 33 VBGP 34 Vref 35 MICM/LIFP 36 MICP/LIFM 37 VDD(BZ) 38 BZM 39
63 EA
MGM857
Fig.2 Pin configuration (LQPF80).
1998 Apr 27
6
Philips Semiconductors
Objective specification
Low cost; low power DECT baseband controllers (ABC-PRO)
5.2 Pin description LQFP80 package PIN 1 2 3 4 5 6 7 8 I/O I/O I/O I O O O O O STATE AFTER RESET(1) HIGH HIGH - HIGH HIGH HIGH LOW LOW SUPPLY DOMAIN VDD(P1,P3) VDD(P1,P3) VDDD VDD(RF) VDD(RF) VDD(RF) VDD(RF) VDD(RF)
PCD509x2/zuu/v family
Table 1
SYMBOL P1.1/INT3 P1.0/INT2 M_RESET ANT_SW0 ANT_SW1 T_ENABLE T_PWR GPP CLK100 VCO_BND_SW GP_CLK7 GP_CLK3 GP_CLK05 R_SLICED on/of S_ENABLE S_DATA S_CLK S_PWR R_ENABLE R_PWR SLICE_CTR VDD(RF) VSS(RF) REF_CLK RSSI_AN T_GMSK/T_DATA R_DATAP R_DATAM VDD(OSC) XTAL2 XTAL1 9
DESCRIPTION 80C51 port pin/external interrupt 3 80C51 port pin/external interrupt 2 master reset input (Schmitt trigger) antenna switch 0 antenna switch 1 enable transmitter switch transmitter power general purpose pin used for the following: 100 Hz signal related to DECT frame timing VCO band switch 6.912 MHz general purpose clock 3.456 MHz general purpose clock 576 kHz general purpose clock ABS bitslice comparator output static high/low.
O O O O O O O - - O I O I I - O I
LOW LOW LOW LOW HIGH HIGH LOW - - running - off - - - running -
VDD(RF) VDD(RF) VDD(RF) VDD(RF) VDD(RF) VDD(RF) VDD(RF) - - VDD(RF) VDD(RF) VDD(RF) VDD(RF) VDD(RF) - VDD(OSC) VDD(OSC)
synthesizer enable serial synthesizer data clock for serial synthesizer interface switch synthesizer power enable receiver switch receiver power switch slicer time constant positive supply voltage for RF interface pins negative supply voltage for RF interface pins programmable reference clock for synthesizer analog input for RSSI measurement transmitter data output, filtered/digital positive input for receiver data negative input for receiver data positive supply for crystal oscillator crystal oscillator output crystal oscillator input
10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
1998 Apr 27
7
Philips Semiconductors
Objective specification
Low cost; low power DECT baseband controllers (ABC-PRO)
STATE AFTER RESET(1) - - - off - off off - 1.2 V off off off - LOW LOW - HIGH HIGH HIGH HIGH HIGH HIGH HIGH HIGH LOW - - HIGH HIGH HIGH HIGH HIGH HIGH HIGH HIGH HIGH HIGH SUPPLY DOMAIN - - VDDA VDDA - VDDA VDDA - VDD(BAT) VDDA VDDA VDDA - VDD(BZ) VDD(BZ) - VDD(P0,P2) VDD(P0,P2) VDD(P0,P2) VDD(P0,P2) VDD(P0,P2) VDD(P0,P2) VDD(P0,P2) VDD(P0,P2) VDD(P0,P2) - - VDD(P0,P2) VDD(P0,P2) VDD(P0,P2) VDD(P0,P2) VDD(P0,P2) VDD(P0,P2) VDD(P0,P2) VDD(P0,P2) VDD(P0,P2) VDD(P0,P2)
PCD509x2/zuu/v family
SYMBOL VSS(OSC) VDD(BAT) VANLI VANLO VDDA EARM EARP VSSA VBGP Vref MICM/LIFP MICP/LIFM VDD(BZ) BZM BZP VSS(BZ) P2.0 P2.1 P2.2 P2.3 P2.4 P2.5 P2.6 P2.7 A16 VSS(P0,P2) VDD(P0,P2) PSEN ALE P0.7 P0.6 P0.5 P0.4 P0.3 P0.2 P0.1 P0.0
PIN 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62
I/O - I I/O O - O O - O O I I - O O - I/O I/O I/O I/O I/O I/O I/O I/O O - - O O I/O I/O I/O I/O I/O I/O I/O I/O
DESCRIPTION negative supply for crystal oscillator positive battery supply voltage analog input to ADC, current output analog output from DAC positive supply voltage for analog circuits negative output to earpiece positive output to earpiece negative supply voltage for analog circuits bandgap output voltage (+1.2 V) reference voltage, microphone supply (+2 V) negative/positive input from microphone/line positive/negative input from microphone/line positive supply voltage for buzzer negative buzzer output positive buzzer output negative supply voltage for buzzer bidirectional Port 3 pins (80C51)
A16 address select negative supply voltage positive supply voltage for periphery pins program store enable (80C51), active LOW address latch enable (80C51) bidirectional Port 0 pins (80C51)
1998 Apr 27
8
Philips Semiconductors
Objective specification
Low cost; low power DECT baseband controllers (ABC-PRO)
STATE AFTER RESET(1) - HIGH HIGH HIGH HIGH HIGH HIGH HIGH HIGH - - - off off HIGH HIGH HIGH HIGH SUPPLY DOMAIN VDD(P0,P2) VDD(P1,P3) VDD(P1,P3) VDD(P1,P3) VDD(P1,P3) VDD(P1,P3) VDD(P1,P3) VDD(P1,P3) VDD(P1,P3) - - - VDD(P1,P3) VDD(P1,P3) VDD(P1,P3) VDD(P1,P3) VDD(P1,P3) VDD(P1,P3)
PCD509x2/zuu/v family
SYMBOL EA P3.7/RD P3.6/WR P3.5/T1 P3.4/T0 P3.3/INT1/IrDA P3.2/INT0 P3.1/TXD P3.0/RXD VSSD VDDD VDD(P1,P3) P1.7/INT9/SDA P1.6/INT8/SCL P1.5/INT7/FS1 P1.4/INT6/DCK P1.3/INT5/DO P1.2/INT4/DI Note
PIN 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80
I/O I I/O I/O I/O I/O I/O I/O I/O I/O - - - I/O I/O I/O I/O I/O I/O
DESCRIPTION external access (80C51), active LOW 80C51 port pin/Read data, active LOW 80C51 port pin/Write data, active LOW 80C51 port pin/Timer 1 input 80C51 port pin/Timer 0 input 80C51 port pin/external interrupt 1/IrDA clock 80C51 port pin/external interrupt 0 80C51 port pin/UART transmit data 80C51 port pin/UART receive data negative supply voltage for digital core positive supply voltage for digital core positive supply voltage for periphery pins 80C51 port pin/external interrupt 9/I2C-bus data 80C51 port pin/external interrupt 8/I2C-bus clock 80C51 port pin/external interrupt 7/SPI Frame Sync 80C51 port pin/external interrupt 6/SPI Data Clock 80C51 port pin/external interrupt 5/SPI Data Out 80C51 port pin/external interrupt 4/SPI Data In
1. In the `State After Reset' column the following symbols are used: a) HIGH means active HIGH, for BUPxSW pin types this means weak pull-up b) LOW means active LOW c) `running' means the clock signal is active d) `off' means the high-impedance state.
1998 Apr 27
9
Philips Semiconductors
Objective specification
Low cost; low power DECT baseband controllers (ABC-PRO)
6 6.1 FUNCTIONAL DESCRIPTION DECT baseband controller system
PCD509x2/zuu/v family
Refer to the block diagram in Fig.1. The DECT Controller consists of a number of functional blocks that operate more or less autonomously and communicate with each other via the System Data RAM (SDR). Blocks have access to SDR via the Internal System Bus (ISB). The ISB consists of an 8-bit data bus, a 10-bit address bus and a number of bus-request/bus-grant signals. Access to the ISB is controlled by ISB Bus Controller (IBC). The IBC acknowledges bus requests on the basis of a priority scheme. The embedded 80C51 controller is to be programmed by the user. It must contain DECT software from Man-Machine Interface (MMI) to the DECT protocols TBC, CBC and DBC (refer to "Figures 10 to 13, in Section 6 of prETS 300 175-3: June 1996"). Software is available from Philips Semiconductors. Hardware state machines in the Burst Mode Logic (BML) and the Speech Interface (SPI) execute the lower blocks in the TBC, CBC and DBC. The 80C51 has control over the BML and the SPI via tables in SDR. The BML saves serial data, received via R_DATAP/M, in buffer areas in SDR. The position of the buffers in SDR is fixed by the 80C51 software by means of the tables previously mentioned. A-fields and B-fields are stored in separate buffers. In this way, two traffic bearers, each with their private A-fields, can share the same B-field buffer as is required in case of bearer hand-over or local call. The DSP and Codec support speech processing functions like analog-to-digital and digital-to-analog conversion, filtering, ADPCM encoding and decoding, 8-bit -law PCM to 14-bit linear PCM conversion and its reverse, echo cancelling, tone generation etc.
The PCD509x2 is a family of baseband controllers, designed for use in Digital Enhanced Cordless Telecommunications systems (DECT). The family is designed for minimal component-count and minimal power consumption for very long standby times. All baseband controllers include an embedded 80C51 microcontroller with on-chip memory, including an IrDA (Infrared Data Association) compatible UART and I2C-bus. The Burst Mode Logic performs the time-critical MAC layer functions for applications in DECT handsets and base stations. The implemented RF Interface is compatible with the Philips Burst Mode Controller PCD504x. The ADPCM transcoding is in compliance with the CCITT Recommendation G.726. Also included is an on-chip codec with receive and transmit filters, complying with CCITT Recommendation G.712. Power-on-reset logic and power management functions further reduce power consumption and external components. The chip is intended to support stand-alone systems only (see Fig.3). There are no provisions to build clusters of base stations. There are no provisions for external controllers to exert control over the embedded 80C51. There are no provisions for external controllers to have direct access to the on-chip data memories. There are no provisions to allow handsets to receive from two unsynchronised base stations simultaneously, but a handset can operate in a multi base station environment as long as they are synchronous base stations.
handbook, full pagewidth
EARPIECE RADIO CIRCUITS PCD50912 MICROPHONE
MGM860
a. Handset.
handbook, full pagewidth
RADIO CIRCUITS
PCD50922
LINE INTERFACE (e.g. PCA1070)
MGM859
a/b line
b. Base station. Fig.3 Block diagram examples of DECT systems with PCD509xy.
1998 Apr 27
10
Philips Semiconductors
Objective specification
Low cost; low power DECT baseband controllers (ABC-PRO)
7 PACKAGE OUTLINE
PCD509x2/zuu/v family
LQFP80: plastic low profile quad flat package; 80 leads; body 12 x 12 x 1.4 mm
SOT315-1
c
y X A 60 61 41 40 Z E
e E HE wM bp 80 1 pin 1 index 20 ZD bp D HD wM B vM B vM A L 21 detail X Lp A A2 A1 (A 3)
e
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT315-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION A max. 1.6 A1 0.16 0.04 A2 1.5 1.3 A3 0.25 bp 0.27 0.13 c 0.18 0.12 D (1) 12.1 11.9 E (1) 12.1 11.9 e 0.5 HD HE L 1.0 Lp 0.75 0.30 v 0.2 w 0.15 y 0.1 Z D (1) Z E (1) 1.45 1.05 1.45 1.05 7 0o
o
14.15 14.15 13.85 13.85
ISSUE DATE 95-12-19 97-07-15
1998 Apr 27
11
Philips Semiconductors
Objective specification
Low cost; low power DECT baseband controllers (ABC-PRO)
8 8.1 SOLDERING Introduction
PCD509x2/zuu/v family
If wave soldering cannot be avoided, for LQFP packages with a pitch (e) larger than 0.5 mm, the following conditions must be observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The footprint must be at an angle of 45 to the board direction and must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 8.4 Repairing soldered joints
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (order code 9398 652 90011). 8.2 Reflow soldering
Reflow soldering techniques are suitable for all LQFP packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 50 and 300 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. 8.3 Wave soldering
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
Wave soldering is not recommended for LQFP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices. CAUTION Wave soldering is NOT applicable for all LQFP packages with a pitch (e) equal or less than 0.5 mm.
1998 Apr 27
12
Philips Semiconductors
Objective specification
Low cost; low power DECT baseband controllers (ABC-PRO)
9 DEFINITIONS
PCD509x2/zuu/v family
Data sheet status Objective specification Preliminary specification Product specification Short-form specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. 10 LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 11 PURCHASE OF PHILIPS I2C COMPONENTS This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. The data in this specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.
Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
1998 Apr 27
13
Philips Semiconductors
Objective specification
Low cost; low power DECT baseband controllers (ABC-PRO)
NOTES
PCD509x2/zuu/v family
1998 Apr 27
14
Philips Semiconductors
Objective specification
Low cost; low power DECT baseband controllers (ABC-PRO)
NOTES
PCD509x2/zuu/v family
1998 Apr 27
15
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010, Fax. +43 160 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 0044 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615800, Fax. +358 9 61580920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777 Internet: http://www.semiconductors.philips.com
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1998
SCA59
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
435102/1200/01/pp16
Date of release: 1998 Apr 27
Document order number:
9397 750 03527

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